Heat pump system

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4843837
SERIAL NO

07103523

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Abstract

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A heat pump system adapted to use a non-azeotropic refrigerant mixture preferably containing a high boiling temperature refrigerant as a primary component thereof is given an improved heat transfer efficiency and its pressure loss is minimized by arranging a refrigerant extracting means for removing the refrigerant stagnating in the system in an unfavorable state, in a vapor state in a condenser or in liquid state in an evaporator and returning the removed refrigerant into a refrigerant circulating passage of the system; and by constructing an evaporator of a flooded type at least at a portion adjacent to a refrigerant outlet portion of the evaporator.

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Patent Owner(s)

Patent OwnerAddress
NEW ENERGY AND INDUSTRIAL TECHNOLOGY DEVELOPMENT CORPORATION21ST 28TH TO 30TH FLOORS SUNSHINE 60 BUILDING 1-1 HIGASHI IKEBUKURO 3-CHOME TOSHIMA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koike, Keiji Tokyo, JP 7 38
Noji, Nobuharu Kanagawa, JP 107 2712
Ogawa, Yasuo Kanagawa, JP 13 95

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