Integrated circuit chip mounting and packaging assembly
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United States of America Patent
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Jun 27, 1989
Grant Date -
N/A
app pub date -
Mar 25, 1986
filing date -
Mar 25, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit chip mounting and packaging assembly is described. The assembly comprises a spreader having one or more chips centrally mounted thereon. A plurality of leads are disposed outward of the integrated circuit chip on the same side of the spreader as the chip. When fully assembled, the spreader is positioned, chip side down, over a cavity in a printed circuit board-like substrate. The cavity is ringed with connectors which contact the spreader leads and appropriately connect the integrated circuit chip to other electronic components mounted on the substrate.
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