High solids enamel
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United States of America Patent
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Jun 13, 1989
Issued Date -
N/A
app pub date -
Feb 23, 1988
filing date -
Dec 29, 1986
priority date (Note) -
Expired
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Abstract
The invention discloses a high solids wire enamel having a surprisingly low viscosity. The enamel comprises a mixture of high molecular weight and low molecular weight linear hydroxy polyethers, a phenolic resin, an isocyanate and possibly a melamine. The resulting enamel has excellent flexibility and resistance to crazing.
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