Method of manufacturing semiconductor device having trapezoidal shaped substrate sections
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United States of America Patent
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Jun 13, 1989
Grant Date -
N/A
app pub date -
Dec 3, 1986
filing date -
Dec 20, 1985
priority date (Note) -
Expired
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Abstract
A method for manufacturing a semiconductor device using inclined stage of a dicing saw in order to cut the semiconductor substrate obliquely with respect to the depthwise direction. When a plurality of semiconductor chips diced obliquely are connected, a degree of connecting accuracy is increased, and it is possible to realize a contact-type image sensor of high resolving power and high accuracy.
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