Tungsten paste for co-sintering with pure alumina and method for producing same

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United States of America Patent

PATENT NO 4835039
SERIAL NO

06935264

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Abstract

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A tungsten paste suitable for co-sintering with 98+% alumina substrate can be produced by adding selected compositions of glass to the paste. Circuit packages produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish. A preferred embodiment of the invention utilizes a substrate comprising narrow size range alumina powder, thus yielding lower sintering temperature and further improvements in shrinkage variability and surface finish.

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Patent Owner(s)

Patent OwnerAddress
CERAMIC PROCESS SYSTEMS 840 MEMORIAL DRIVE CAMBRIDGE 02139MA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Barringer, Eric A Waltham, MA 21 414
Foster, Brian C Sutton, MA 6 164
Hodge, James D Medway, MA 25 372
Lind, Roger S Acton, MA 3 63

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