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Abstract

A complex-shaped bonded body of silicon nitride having a high bonding strength of more than 30 kg/mm.sup.2 as flexural strength and continuously homogenous microstructure through the bonded portion can be obtained by the method comprising the following five steps: (a) molding a body from a mixture of silicon powder having a diameter of less than 44 .mu.m and non-oxide ceramics powder having a diameter of less than 44 .mu.m, (b) heating a molded body obtained by step (a) at a temperature of 600 to 1500.degree. C. in a non-oxide atmosphere such as nitrogen or argon gas to sinter said silicon powder and partially convert to silicon nitride retaining 60 to 100 wt. % unreacted silicon powder therein, (c) grinding a surface to be bonded together with other bodies of said presintered body obtained by step (b) to dispose of unreacted silicon thereon, (d) placing a bonding agent containing silicon powder having a diameter of less than 44 .mu.m and polycarboxy silane resin between two bonding surfaces prepared by step (c), pressing together and drying said bonding agent, and (e) sintering the two presintered bodies pressed together in nitrogen atmosphere at a temperature of 1200.degree. to 1500.degree. C. without melting said disposed unreacted silicon.

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First Claim