Apparatus and method for aligning surface mountable electronic components on printed circuit board pads
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United States of America Patent
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May 23, 1989
Grant Date -
N/A
app pub date -
Aug 4, 1987
filing date -
Aug 4, 1987
priority date (Note) -
Expired
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Abstract
A method and apparatus are described for precisely centering the leads of surface mountable electronic components on the pads of a printed circuit board. The method includes coating the pads with solder, placing the leads of the components on the solder coated pads, melting the solder and vibrating the leads relative to the pads while the solder is molten, so that the surface tension of the molten solder centers the leads on the pads. The molten solder is then cooled until it resolidifies.
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