Work chuck for wire bonder and method
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United States of America Patent
Stats
-
May 2, 1989
Grant Date -
N/A
app pub date -
Mar 21, 1988
filing date -
Mar 21, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus and method for making high-speed wire bonds between a semiconductor chip and a chip carrier. A chuck supported on a pushrod passing through a rotating sleeve holds the chip and provides Z- and theta- motions, while the bonding head provides X- and Y- movements relative to the chip. Limiting the bonding head to X- and Y- motions significantly reduces the dynamic forces on the bonding head and supporting mechanism, thereby enabling a faster rate of reliable operation. A signal source directly contacts the pushrod to provide reference signals to control circuitry regarding the position of the anvil and chip supported thereon.
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