Method of manufacturing multiwire lead assemblies
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United States of America Patent
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-
Apr 11, 1989
Grant Date -
N/A
app pub date -
Sep 9, 1987
filing date -
Sep 9, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a multiwire lead assembly for a flexible connector between thin film elements and other electronic circuitry during manufacturing thin film heads for computer disc drives includes the process of supporting the multiple wires in spaced locations on retainers, such as terminal boards, and fixing the wires to such terminal boards. The terminal boards are spaced apart a desired distance for making the lead assembly. The wires are separated from the source reel and then the two terminal boards are a supported assembly and the center portions of the multiple wires are twisted together while the end portions are held separated and oriented by the terminal boards. The twisted wire portion of the wires then can be insulated at desired locations, including for example the full length of the twisted portion. The ends of the wires are stipped of their normal insulating coating utilizing a laser stripper in a known manner. The stripped areas are used for connection to two components that are to be electrically connected.
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