Process for curing epoxy encapsulant on integrated circuit dice

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United States of America Patent

PATENT NO 4818726
SERIAL NO

07175164

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides a method for protecting integrated circuit packages mounted on carrier tapes during manufacturing steps commonly employed in tape automated bonding processes. A reel is provided for winding the carrier tape into a compact package. A steel tape with corrugated longitudinal edges is also provided for winding on the reel in alternating layers with the carrier tape. The carrier tape thus is framed, layer by layer, with the steel tape, thus protecting each integrated circuit package from coming into contact with another object during manufacturing steps, e.g. heat curing.

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Patent Owner(s)

Patent OwnerAddress
VTC INC A CORP OF MNNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Flaten, Nordahl T Burnsville, MN 1 5

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