Process and apparatus for low pressure chemical vapor deposition of refractory metal
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United States of America Patent
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Apr 4, 1989
Issued Date -
N/A
app pub date -
Sep 4, 1987
filing date -
May 23, 1983
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process and apparatus for the low pressure, cold wall, chemical vapor deposition of refractory metals, such as tungsten on a silicon wafer. The silicon wafer is introduced into a loading lock wherein the pressure is reduced to subatmospheric pressure. The silicon wafer is transferred to a deposition chamber where it is heated to an elevated temperature. A refractory metal carbonyl vapor is introduced into the deposition chamber and dissociates to deposit a refractory metal on the silicon wafer. The wafer is transferred to an unloading lock where it is allowed to cool and is then removed.
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Cited Art Landscape
Patent Citation Ranking
- 39 Citation Count
- C23C Class
- 0 % this patent is cited more than
- 36 Age