Process for the production of circuit board and the like
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United States of America Patent
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Mar 14, 1989
Grant Date -
N/A
app pub date -
Oct 15, 1987
filing date -
Dec 27, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for the production of a molded article such as a circuit board and the like includes applying catalyst such as palladium, gold, etc. to a primary molded article after roughening of its surfaces, then, after such pre-treatment, the primary molded article is set into a mold to form a secondary molded article covered with cover material only leaving a portion to be subjected to metal plating, and then the secondary molded article is removed from the mold and subjected to metal plating, and finally the cover material is removed after metal plating.
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