Process for the production of molded articles having partial metal plating
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United States of America Patent
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Mar 14, 1989
Grant Date -
N/A
app pub date -
Oct 15, 1987
filing date -
Nov 18, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to a process for the production of a molded article partially plated with metal as in the case of circuit boards, connectors, decorative articles, etc., where a catalyst such as palladium, gold, etc. is added after roughening of the surface of the primary molded article, and then, the molded article is inserted into the mold and molded so that the portions to be plated with metal are exposed outwardly, and after such molding, the secondary molded material is plated with metal.
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