Method of securing electronic components to a substrate
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United States of America Patent
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-
Mar 7, 1989
Grant Date -
N/A
app pub date -
Mar 25, 1987
filing date -
Apr 22, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In order to secure electronic components, and particularly large-area power semiconductors, to a substrate, first a paste formed of metal powder and a solvent is applied in the form of a layer to a contacting layer of the component and/or a contact surface of the substrate. The layer of paste is then dried. When the paste has dried, the component is placed onto the substrate, whereupon the entire arrangement is heated to a relatively low sintering temperature preferably between 180.degree. C. and 250.degree. C., and with simultaneous application of a mechanical pressure of at least 900 N/cm.sup.2. A connection which is thus achieved by such a pressure sintering at relatively low sintering temperatures is particularly suitable for securing power semiconductors produced in MOS-technology to a substrate.
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