Thermally conductive, electrically insulative laminate

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United States of America Patent

PATENT NO 4810563
SERIAL NO

07114855

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Abstract

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A thermally conductive laminate structure for use as a mounting base and/or chassis attachment member in combination with solid-state electronic devices, the laminate preferably comprising up to five layers including a pair of outer metallic layers disposed on opposite sides of center composite layers of electrically insulative layers separated by an interposed metallic layer. The center insulative layers are films of polyimide(amide) material, with the polyimide(amide) film being filled with a quantity of aluminum oxide, boron nitride, or other suitable particulate solid in an amount ranging from between about 30% and 100% by weight of polyimide(amide) solids. The outer layers are metallic, with the base member being a metallic pad of copper or aluminum, and with the opposed metallic layer being copper and arranged in a printed circuitry pattern or array.

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Patent Owner(s)

Patent OwnerAddress
BERGQUIST COMPANY THE A CORP OF MN5300 EDINA INDUSTRIAL BLVD MINNEAPOLIS MN 55435

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeGree, David C Burnsville, MN 7 210
Fick, Herbert J Northfield, MN 5 285
Juenger, Bruce H Northfield, MN 2 129

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