Palladium-base electroless plating solution
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United States of America Patent
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Feb 14, 1989
Grant Date -
N/A
app pub date -
Oct 21, 1987
filing date -
Mar 4, 1986
priority date (Note) -
Expired
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Abstract
The present invention provides a palladium-base electroless plating solution which is excellent in stability and which is capable of forming a satisfactory palladium-base deposit, the solution being an aqueous solution containing (a) a palladium compound, (b) at least one compound of ammonia and amine compounds, (c) an organic compound containing bivalent sulfur, and (d) at least one compound of hypophosphorous acid compounds and boron hydride compounds, and a palladium-base electroless plating solution containing a nickel compound in addition to said electroless plating solution.
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