Metallizing paste
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United States of America Patent
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Jan 24, 1989
Grant Date -
N/A
app pub date -
Oct 23, 1986
filing date -
Oct 25, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A metallizing paste capable of being used for screen printing applications which comprises tungsten powder and an organic vehicle system. The organic vehicle system can comprise a polymeric material, such as ethyl cellulose, and a solvent, such as terpineol. The paste preferably includes frit material, such as one or more of alumina, cerium fluoride, bismuth oxide and silica. The paste may also include manganese and/or nickel. There is also disclosed a semi-conductor package made using the metallization paste. The package includes a conductive attachment area, conductive feed-through paths, conductive vias and a conductive external underside, all of which are formed using the metallization paste in various formulations.
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