Surface-mounted single package data acquistition system
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United States of America Patent
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Dec 20, 1988
Issued Date -
N/A
app pub date -
Mar 2, 1988
filing date -
May 3, 1986
priority date (Note) -
Expired
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Abstract
Integrated circuits in the form of a multiplexer, an instrumentation amplifier, a sample-and-hold amplifier, and an A/D converter are mounted on a single substrate, forming a data acquisition system capable of selecting one of a number of analog signals and converting it into a digital number. The resulting package is mounted in a leadless chip carrier (LCC) suitable for surface mounting.
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