Temperature modulated glue bead testing apparatus
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United States of America Patent
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-
Nov 29, 1988
Grant Date -
N/A
app pub date -
Mar 28, 1985
filing date -
Mar 28, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A testing apparatus is provided for applying a glue bead to a first sheet of material and then adhering a second sheet of material thereto. The testing apparatus includes a glue tank and a glue head attached thereto both of which are adapted to measure and control the temperature of the glue therein. The glue head applies the glue to the first sheet of material at a preselected rate. The first sheet of material then passes to a compression cylinder which urges the second sheet of material into contact with the first sheet of material. The pressure and duration of the contact between the first and second sheets of material can be varied.
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