One-component, particle-filled compositions
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United States of America Patent
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Nov 22, 1988
Issued Date -
N/A
app pub date -
May 13, 1987
filing date -
Mar 27, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Unfavorable interaction is prevented between (a) electroconductive particle fillers and (b) organic resin binders of the type which are normally instable with respect to viscosity when aged in contact with said fillers. Moreover, electroconductivity degradation is also avoided. In a preferred mode of the invention, the particle surface is treated with a coating of an interfacial pacifying agent such as a tetravalent tin compound which both enhances the electroconductive performance of the particles and also is sufficiently compatible with the resin binder to migrate into the binder sufficiently to avoid undue gelling of the binder by particle-borne contamination or residues of such contamination.
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