Autogenous attrition grinding

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4775393
SERIAL NO

06868954

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Abstract

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A method for grinding silicon carbide to a submicron powder which comprises grinding a silicon carbide feed material having an average particle size of between 1 and 200 microns in a liquid slurry in a contamination free high energy autogenous attrition mill in the presence of silicon carbide media for a sufficient time to obtain a specific surface area of at least 5 m.sup.2 /g and preferably at least 9 m.sup.2 /g. The media is of high purity and has an average particle size of less than 4 mm and preferably less than 2.5 mm. The ground material is then further treated so that the average particle size is less than one micron and so that greater than 97 numerical percent of the particles of the finished powder is smaller than 5 microns. The invention includes the finished powder.

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Patent Owner(s)

Patent OwnerAddress
STEMCOR CORPORATION 200 PUBLIC SQUARE CLEVELAND OHIO 44114 A CORPORATION OF DELAWARENot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Boecker, Wolfgang D G Lewiston, NY 17 416
Korzekwa, Tadeusz M Lewiston, NY 7 100

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