Electrolytic apparatus and process
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United States of America Patent
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Sep 27, 1988
Issued Date -
N/A
app pub date -
Jun 5, 1987
filing date -
Feb 3, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved electrolytic apparatus and process particularly applicable for high-speed electrodeposition of a metallic plating on a substrate such as on a printed wiring board of the type employed in the electronic industry. The apparatus employs a manifold assembly adapted to be immersed in the electrolyte and positioned adjacent to each of the anodes immersed therein for withdrawing electrolyte past the anode to provide a controlled rate of flow across the anode surface to achieve a substantially uniform mass transport rate across the fluid film on the surface of the anode. The apparatus is also adapted for returning at least a portion of the withdrawn electrolyte to the tank which can be arranged so as to impinge upon the article being plated.
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