Method and apparatus for electroplating a metallic deposit on interconnected metallic components and/or metallized products
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United States of America Patent
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Sep 13, 1988
Grant Date -
N/A
app pub date -
Apr 1, 1987
filing date -
Apr 2, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Method for electroplating a metallic deposit on interconnected or bandoliered elongate metallic and/or metallized products, whereby providing for non-conductive masking devices between the products, of which at least the parts which are in contact with the products consist of resilient material while, after providing for the said masking devices, the products are submitted to a contact with an electrolyte.
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