Alumina materials for low temperature co-sintering with refractory metallization
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United States of America Patent
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Sep 6, 1988
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N/A
app pub date -
Nov 26, 1986
filing date -
Nov 26, 1986
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Expired
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Abstract
Substrates consisting of at least 98% narrow size distribution ceramic particles are co-sinterable with metallized paste to which selected compositions of glass have been added. Substrates produced in accordance with the present invention exhibit superior thermal conductivity, low shrinkage variability, and smoother and more homogeneous surface finish.
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