Substrate for a printed circuit board
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United States of America Patent
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Sep 6, 1988
Grant Date -
N/A
app pub date -
Apr 23, 1987
filing date -
Apr 25, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A substrate for a printed circuit board, comprising a metal core plate having apertures and an inorganic fiber cloth impregnated with a heat resistant thermoplastic resin, coated thereon, wherein said apertures are filled with a mixture of said resin and an inorganic filler.
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