Thermal transfer recording medium having an improved hot-sticking resistance
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United States of America Patent
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Aug 16, 1988
Grant Date -
N/A
app pub date -
Nov 19, 1986
filing date -
Nov 20, 1985
priority date (Note) -
Expired
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Abstract
A thermal transfer recording medium having an improved hot-sticking resistance which comprises a thermoplastic resin film as a substrate, a thermally transferable ink layer provided on one surface of the film, and a thin layer of an inorganic substance provided on the other surface of the film. The thin layer of the inorganic substance prevents the recording medium from hot-sticking phenomenon, whereby a high speed printing is made possible.
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