Water-based thermoforming adhesives
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United States of America Patent
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Aug 9, 1988
Grant Date -
N/A
app pub date -
May 5, 1987
filing date -
May 5, 1987
priority date (Note) -
Expired
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Abstract
This invention presents new water-based adhesives suitable for use in thermoforming lamination systems. More particularly, this invention presents water-based adhesive-forming compositions comprising an aromatic polyurethane in water dispersion or emulsion and a compatible cross-linking agent; also includable in the compositions are thickening agents and pigments. These new adhesives, it has been found, exhibit bonding strengths and temperature resistance far superior to the solvent and water-based adhesives currently used in industrial applications, and are useful in thermoforming lamination processes. Also disclosed is a one-step thermoform lamination edge-folding process using the adhesive.
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