High speed reticle change system
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United States of America Patent
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-
Jul 26, 1988
Grant Date -
N/A
app pub date -
Nov 5, 1986
filing date -
Nov 5, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Method and apparatus are disclosed for speeding up reticle changes during the production of semiconductor wafers under those circumstances wherein three reticles are employed, one (C) having a substantially longer exposure period than the others (A, B). The wafer is exposed to the reticles in the sequence ACB-BCA-ACB, etc.
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