Method of producing wafer
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United States of America Patent
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-
Jul 12, 1988
Grant Date -
N/A
app pub date -
Oct 10, 1986
filing date -
Oct 23, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is disclosed a method of providing an elongated stock; producing a wafer comprising the steps of processing one end face of an elongated stock to form a first flat surface; cutting through one end portion of the stock transversely by a cutter to provide a slice of a predetermined thickness having opposite side faces defined respectively by the first flat surface and a cut surface subjected to the cutting; and processing the cut surface of the slice to form a second flat surface, using the first flat surface as a reference surface, thereby providing the wafer.
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