IC card and method for manufacturing the same
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United States of America Patent
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Jun 28, 1988
Issued Date -
N/A
app pub date -
Sep 11, 1987
filing date -
May 30, 1984
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In an IC card according to the present invention, a base sheet formed of thermoplastic material is sandwiched between a substrate sheet and a dummy sheet both formed of nonplastic material lower in thermoplasticity than the base sheet. The substrate sheet is fitted with at least one IC chip and input/output terminals electrically connected to the IC chip. First and second cover sheets formed of thermoplastic material are put individually on the outer surfaces of the substrate sheet and the dummy sheet. The cover sheet on the substrate sheet is formed with apertures through which the input/output terminals are exposed to the outside.
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