Process for the manufacture of a target for cathodic sputtering
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United States of America Patent
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Jun 21, 1988
Grant Date -
N/A
app pub date -
Apr 30, 1987
filing date -
Apr 30, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for forming a metallic sputter target and a metallic sputter target product are provided. The process provides a dense homogenious bulk material of high strength comprising ductile metal components which forms a brittle composition when alloying. The process employs a mixture of individual components at least one of which being ductile at room temperatures. The individual components can be all metals, or a mixture of metals and non-metals. The individual components are formed into a powder mixture in a first step. Unlike hot pressing or other melting techniques which can cause ductile components to alloy into brittle materials, the powder mixture is cold pressed to form a shaped body which is thereafter densified by repeated working at temperatures below the lowest of the melting points of the individual components. This treatment occurs under conditions of material flow and cold welding. The resultant product is a dense target wherein the individual components continue to exist as a mixture of powders. The sputter target of the invention has the density and mechanical strength required of commercial sputter targets. The target product is machinable.
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