Dispersion strengthened metal composites
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United States of America Patent
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Jun 21, 1988
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N/A
app pub date -
Dec 13, 1983
filing date -
Dec 13, 1983
priority date (Note) -
Expired
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Abstract
There is provided a substantially fully dense powdered metal composite comprising a highly conductive metal or metal alloy matrix having dispersed therein discrete microparticles of a refractory metal oxide and discrete macroparticles of an additive metal or metal alloy, such as a nickel/iron alloy. The respective components undergo minimal alloying because sintering is not utilized in forming the composite. These composites are characterized by high thermal or electrical conductivity and a desired property attributable to the composite forming additive metal or metal alloy. The composites are useful in forming lead frames for integrated circuit chips, electric lamp lead wires, and electrical contact members.
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