Waferboard lumber
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United States of America Patent
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-
Jun 14, 1988
Issued Date -
N/A
app pub date -
Sep 3, 1986
filing date -
Feb 14, 1986
priority date (Note) -
Expired
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Abstract
Substitute lumber pieces having strengths and densities substantially equivalent to lumber are cut from single layer panels of over about 1 and normally less than 4 inches thickness made from wood wafers. The wafers are oriented with their lengths having a mean deviation to the longitudinal length of the panel measured in the major plane of the panel in the range of 0 to 10 degrees and a mean deviation measured in a minimum longitudinal plane perpendicular to the major plane from 0 to about 5 degrees and have an average effective length of at least 8 inches (200 mm), and preferably an average thickness less than 0.15 inches (4 mm) and a width of at least 0.25 inches (6 mm). Lumber is made by cutting the panel longitudinally. Preferably the panels are formed to have a substantially uniform density profile throughout their thicknesses.
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