Method of producing a combination cover
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United States of America Patent
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-
Jun 14, 1988
Grant Date -
N/A
app pub date -
Nov 21, 1986
filing date -
Nov 21, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A process for manufacturing combination covers for closing and sealing an electronic package that includes a ceramic lid having a noble metal base frame thick-filmed onto the lid and fired therewith to fuse the base metal to the lid. A gold-tin solder frame is placed over the base frame and bonded thereto to complete the cover.
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