Low temperature cure having single component conductive adhesive
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United States of America Patent
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May 31, 1988
Issued Date -
N/A
app pub date -
Jan 28, 1987
filing date -
May 8, 1985
priority date (Note) -
Expired
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Abstract
An electrically conductive adherent film-forming adhesive which is rapidly curable thermally from a flowable liquid to an adherent and coherent solid at temperatures below about 120.degree. C. and with a specific resistivity of less than about 0.001 ohm-cm. when cured, and comprising a uniform mixture with a formulation containing a liquid epoxy base resin, a hardening component for the epoxy resin consisting essentially of B.multidot.CF.sub.3 SO.sub.3 H, and silver metallic powder in an amount ranging from about 75% to 85%, with the powder having a substantial uniform particle size of less than about 20 microns (0.8 mil) in diameter.
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