Ceramic combined cover

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 4746583
SERIAL NO

06933568

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.

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Patent Owner(s)

Patent OwnerAddress
WILLIAMS GOLD REFINING COMPANY INCORPORATED 2978 MAIN STREET BUFFALO NY 14214 A CORP OF NYNot Provided

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Falanga, Richard J Utica, NY 2 41

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  • 30 Citation Count
  • B32B Class
  • 0 % this patent is cited more than
  • 37 Age
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