Method of soldering an integrated circuit and printed circuit board
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United States of America Patent
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-
May 3, 1988
Grant Date -
N/A
app pub date -
Jul 28, 1986
filing date -
Jul 27, 1985
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of soldering an integrated circuit with yielding connecting contacts rigidly mounted on the integrated circuits to printed circuit boards. The integrated circuit is inserted in a clamped manner into a formed opening in a printed circuit board and the connecting contacts are soldered with the conductors by means of customary soldering methods for mass production such as by wave soldering.
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