Nickel clad corrosion resistant lid for semiconductor package
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United States of America Patent
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Apr 12, 1988
Grant Date -
N/A
app pub date -
Dec 22, 1986
filing date -
Dec 22, 1986
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A lid for closing an electronics package exhibits a high corrosion resistance. The lid is formed of a metal substrate which is clad with rolled or worked nickel, and covered with a layer of gold or precious metal electroplate. At edges of the lid, which are not covered with cladding, a layer of nickel is electroplated, employing the dogbone effect to concentrate the metallization at the edges. The rolled or worked metal has a much smaller porosity than an electroplated layer, and the nickel cladding can be applied to the desired thickness in much less time than nickel electroplate.
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