Heat dissipation mechanism for power semiconductor elements
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United States of America Patent
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-
Mar 22, 1988
Grant Date -
N/A
app pub date -
Sep 18, 1986
filing date -
Sep 30, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A power semiconductor column has power semiconductor elements arranged in alternation with thermally and electrically conductive evaporation blocks. Each evaporation block is connected in a separate heat-dissipating fluid circuit. Each fluid circuit has a heat exchanger connected to the corresponding evaporation block by way of a pair of flexible, electrically insulating fluid connections. Heat-carrying dielectric fluid circulates within each circuit between the evaporation block and the heat exchanger, cooling of the semiconductor elements being effected by evaporation of the fluid in the evaporation block and condensation of the fluid in the heat exchanger.
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