Alpha methylstyrene and para methylstyrene copolymers
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United States of America Patent
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Mar 22, 1988
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N/A
app pub date -
Dec 17, 1985
filing date -
Nov 20, 1984
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Expired
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Abstract
Disclosed are copolymers of alpha methylstyrene and para methylstyrene having Ring & Ball softening points greater than 140.degree. C., a Tg of greater than 100.degree. C. to 110.degree. C., a weight average molecular weight (Mw) of less than 15,000, and a molecular weight distribution of about 2 to about 3. These copolymers are useful in adhesives, sealants and molding compounds, especially as reinforcing or modifier resins for thermoplastic block copolymers having aromatic and aliphatic blocks contained in pressure sensitive adhesives.
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