Importance

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Abstract

An integrated circuit is mounted on the front face of a substrate of dielectric material and the substrate is fitted in an aperture that extends through a circuit board. The substrate has contact elements distributed about the periphery of its front face, and the circuit board has corresponding contact elements on its front face distributed about the periphery of the aperture. A first clamping member is positioned at the back face of the circuit board so as to extend over the aperture in the circuit board. The first clamping member is made of thermally-conductive material and is in thermally-conductive contact with the back face of the substrate. A second clamping member is positioned at the front face of the circuit board and extends at least partially over the peripheral area of the front face of the substrate. A resilient member is effective between the second clamping member and both the substrate and the circuit board. Fastening elements are used to draw the clamping members together and thereby press the resilient member into firm contact with the substrate and the circuit board. The resilient member has portions of conductive material that connect the contact elements of the substrate to the corresponding contact elements of the circuit board.

First Claim