Soldering apparatus
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United States of America Patent
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Feb 23, 1988
Grant Date -
N/A
app pub date -
Jul 17, 1986
filing date -
Jul 24, 1985
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A soldering apparatus is disclosed having a first vessel through which printed circuit boards are transferred for soldering by a combination of a solder wave and hot vapors of a heat transfer liquid, a second vessel in which heat transfer liquid is heated and vaporized, a gas feed conduit extending between the first and second vessels and having a pump for feeding the vapors produced in the second vessel to the first vessel, and a liquid recycling conduit extending between the first and second vessels and having a pump for recycling heat transfer liquid formed by the condensation of the vapors and collected in the first vessel to the second vessel.
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