Method for monitoring microhole growth during production of microholes having a predetermined diameter
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United States of America Patent
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Feb 16, 1988
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app pub date -
Nov 20, 1986
filing date -
Oct 13, 1983
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Abstract
In a method for producing a substrate with microholes having a predetermined diameter, a test region on the substrate is irradiated with a significantly higher dosage of heavy ions than the rest of the substrate. During the development of the nuclear traces by etching, the surface of the substrate in the test region abruptly changes at a certain porosity. This macroscopically observable process is then utilized to interrupt the etching process after a precisely defined time, which is calibrated to provide microholes having a predetermined diameter on the remainder of the substrate.
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