Integrated-circuit leadframe adapted for a simultaneous bonding operation
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United States of America Patent
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Jan 26, 1988
Grant Date -
N/A
app pub date -
Mar 22, 1984
filing date -
Mar 22, 1984
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.
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