Polyimide precursor compositions, their manufacture, the resultant polyimides and their use, particularly for manufacturing enamelling varnishes for electric wires
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United States of America Patent
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Jan 19, 1988
Issued Date -
N/A
app pub date -
Sep 10, 1986
filing date -
Jul 25, 1984
priority date (Note) -
Expired
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Abstract
Polyimide precursor compositions are described which may be prepared by rting a biprimary aromatic diamine with a diester-diacid or an aromatic tetraacid, and then with the substantially stoichiometrical complement of an aromatic dianhydride. The polyimide precursor compositions are used in the manufacture of insulating coatings, films, impregnating or enamelling varnishes for electric wires etc., and have excellent qualities of flexibility, adhesiveness and heat resistance.
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