Wire bonder with open center of motion
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United States of America Patent
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-
Jan 12, 1988
Issued Date -
N/A
app pub date -
Dec 19, 1986
filing date -
Dec 19, 1986
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A movable open center mounting for the tool of an ultrasonic wire bonding machine employs ball-bearing rollers (22, 24, 30, 32) to permit limited motion of the wire bonding tip (13a) substantially constrained to a vertical line with a minimum of tip skid. The mounting structure which is all positioned on one side of the tool tip includes a frame (10) of inverted U-shape having a pair of mutually spaced ball-bearing rollers (22, 24, 30, 32) on the end of each frame leg and a transducer support (12) positioned between the frame legs and having fixed roller contacting rods (90, 92, 96, 98) extending fore-and-aft between and partly under each of the respective rollers. A pair of springs (80, 82) urges the transducer support upwardly to press the fixed rods against the roller surfaces, allowing the transducer support to effectively rock about a center of motion (120) that is well below the bonder frame and transducer support, with the rocking motion being so constrained that the bonder tip moves substantially in a straight vertical line for small displacements.
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