Palladium and palladium alloy plating
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United States of America Patent
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Dec 29, 1987
Grant Date -
N/A
app pub date -
Jan 21, 1986
filing date -
Jan 25, 1985
priority date (Note) -
Expired
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Abstract
The difficulties associated with electroplating palladium metal or alloy deposits from palladium diammino dichloride, palladium diamino dinitrite and palladium triammino sulphite baths can be avoided by plating from palladium baths containing oxalate. The palladium and oxalate may be in a single complex, such as palladium diamino oxalate, (Pd(NH.sub.3).sub.2 C.sub.2 O.sub.4), palladium tetraamino oxalate (Pd(NH.sub.3).sub.4 C.sub.2 O.sub.4) or an ammonium or alkali metal salt of palladium dioxalate (M.sub.2 Pd(C.sub.2 O.sub.4)).sub.2), where M represents an ammonium or alkali metal cation. Alloying metal ions may also be present, as may an electrolyte, a brightener and/or a stress reducer.
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