Methods of adhering a self-fusing tape to a substrate
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United States of America Patent
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Dec 15, 1987
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N/A
app pub date -
Aug 6, 1986
filing date -
Mar 15, 1982
priority date (Note) -
Expired
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Abstract
A process is provided for affixing to a substrate a non-tacky, flexible layer consisting of a raw polymer mixture of a minor proportion of high density polyethylene, linear low density polyethylene or isotactic polypropylene and a major proportion of elastomeric polymer of which at least about 50 percent by weight is butyl rubber, by applying a stretching elongation to the flexible layer before application to the substrate. The process may be used in a wide variety of applications, for example, to cover metal parts, make repairs to cracked cover components and electrical wiring splicing and to repair leaks in pipes or hoses.
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