Apparatus for soldering printed circuit boards
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United States of America Patent
Stats
-
Dec 15, 1987
Grant Date -
N/A
app pub date -
Nov 9, 1983
filing date -
Jan 18, 1983
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Printed circuit boards to be soldered are placed in a magazine and automatically fed, one by one, to a printed circuit board-processing line. The processed boards are automatically collected in another, empty magazine. Lifting means is provided for vertically displacing the boards-carrying magazine to position respective boards at a predetermined feed location where an air cylinder feeds each board to the processing line. Another lifting means is provided for vertically displacing the empty magazine to position respective holding members of the magazine at a delivery location and to receive therein the processed board displaced by an air cylinder.
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