High reliability metal and resin container for a semiconductor device
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United States of America Patent
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-
Dec 8, 1987
Grant Date -
N/A
app pub date -
Nov 29, 1983
filing date -
Dec 1, 1982
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A container for a semiconductor device has a metal plate and a body of synthetic resin which encapsulates a part of the plate, keeping a large surface thereof exposed. In the area separating the part encapsulated within the body of resin and the part without the resin, the plate has two opposed side notches and at least one groove connecting them.
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